REDMI 13

Technology GSM / HSPA / LTE

2G bands GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2

3G bands HSDPA 850 / 900 / 2100

4G bands 1, 3, 5, 7, 8, 20, 28, 38, 40, 41

Speed HSPA, LTE

LAUNCH

Announced 2024, June 03

Status Available. Released 2024, June 03

BODY

Dimensions 168.6 x 76.3 x 8.3 mm (6.64 x 3.00 x 0.33 in)

Weight 205 g (7.23 oz)

Build Glass front, plastic frame, glass back

SIM Hybrid Dual SIM (Nano-SIM, dual stand-by)

  IP53, dust and splash resistant

DISPLAY

Type IPS LCD, 90Hz, 550 nits (HBM)

Size 6.79 inches, 109.5 cm2 (~85.1% screen-to-body ratio)

Resolution 1080 x 2460 pixels (~396 ppi density)

Protection Corning Gorilla Glass

PLATFORM

OS Android 14, HyperOS

Chipset Mediatek Helio G91 Ultra (12 nm)

CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55)

GPU Mali-G52 MC2

MEMORY

Card slot microSDXC (uses shared SIM slot)

Internal 128GB 6GB RAM, 128GB 8GB RAM, 256GB 6GB RAM, 256GB 8GB RAM

  eMMC 5.1

MAIN CAMERA

Dual 108 MP, f/1.8, (wide), 1/1.67", 0.64µm, PDAF

2 MP, f/2.4, (macro)

Features LED flash, HDR

Video 1080p@30fps

SELFIE CAMERA

Single 13 MP, f/2.5, (wide)

Features HDR

Video 1080p@30fps